It has long been no secret that Taiwanese chipmaker MediaTek, which haunts American Qualcomm, is preparing to announce a new sub-flagship processor, the Dimensity 8400, and now more or less specific information has appeared about the upcoming new product.
The MediaTek Dimensity 8400 single-chip system is reportedly based on the processor core architecture. 1+3+4 and it will be produced at the factories of the contract manufacturer TSMC according to 4nm technological standards.
The SoC Dimensity 8400 will include one powerful Arm Cortex-A725 core with an operating frequency of up to 3.0 GHz, three Cortex-A725 cores with a frequency of slightly less than 3.0 GHz, as well as a quartet of “light” Cortex-A720 cores, the frequency of which will not exceed 2.0 GHz. The Arm Immortalis G925 controller will be responsible for graphics, the same as the top-end Dimensity 9400 chip, although the number of cores is not specified.
The source also clarifies that the performance of the future Dimensity 8400 chipset is still under optimization, so the final clock speeds and overall performance of the chip may change by the time of the announcement.
It is not clear which smartphones will receive the Dimensity 8400 chip in the future, but we can safely assume that the fall Xiaomi 15T and Xiaomi 15T Pro subflagmans will be built on MediaTek Dimensity 8400 and Dimensity 9400 processors, respectively.