Today, as planned, Taiwanese chipmaker MediaTek officially announced its new single-chip system of the MediaTek Dimensity 8400 subflagman level.
According to the developer, relative to the Dimensity 8300 chipset, the novelty has become 10% faster in processor computing, 24% faster in graphics, and power consumption has decreased by 35% and 42%, respectively.
The Dimensity 8400 was equipped with 8 Arm Cortex-A725 cores, the second-level cache was doubled, and the third-level cache was expanded by 50%. One core of the Cortex-A725 runs at 3.25 GHz, three at 3.0 GHz and four at 2.1 GHz.
The Arm Mali-G720 MC7 graphics controller, which is equipped with the Dimensity 8400, operates at a frequency of 1.3 GHz, and the chip itself is manufactured using a 4nm process technology at TSMC facilities.
The SoC Dimensity 8400 also includes an updated NPU 880 neural chip and an Imagiq 1080 image processor (ISP).
It claims support for LPDDR5X RAM, UFS 4.0+MCQ flash drives, 320-megapixel cameras, video recording up to 4K@60fps, and screens with WQHD+ resolution and a frame rate of up to 144 Hz.
The wireless modem supports 5G network standards, as well as Wi-Fi 6 and Bluetooth 5.4 wireless interfaces.
The first smartphones based on the MediaTek Dimensity 8400 chip will appear in January 2025, and one of them should be the Redmi Turbo 4.