Micron has announced the world’s first UFS 4.1 and UFS 3.1 storage solutions based on G9 smartphones, which provide more artificial intelligence features on the device.
The new storage chips will be available on flagship products shortly after the Micron LPDDR5X 1y chips, which will be available in early 2026.
The UFS 4.1 and UFS 3.1 mobile storage chips are based on the Micron G9 technology node and offer improved energy efficiency and read/write speeds. The capacity of the chips will range from 256 GB to 1 TB, and they are suitable for ultrathin and foldable smartphones.
But in addition to the hardware improvements, Micron promises some software tweaks that will enhance the user experience and boost the performance of some AI tasks.
For example, UFS 4.1 storage solutions support Zoned UFS, increasing read-write efficiency and reducing write gain, while Data Defragmentation improves data movement and defragmentation inside a UFS device by 60%.
Pinned WriteBooster, in turn, provides faster access to the data stored in the WriteBooster buffer – up to 30%. And Intelligent Latency Tracker automatically performs debugging by analyzing the delay logs. The latter feature is also available in UFS 3.1, while others seem to be exclusive to UFS 4.1 chips.